The Laser Dicing Disco

DISCO laser solutions are gaining popularity in a wide range of industries. Micro LEDs are one such example; they will soon be used in the next generation display. Deep ultra-violet LEDs are also produced using laser lift-off technology. In addition, laser patterning is now used as a pretreatment process for the production of small dies. The applications of laser technology are many, and are likely to continue to expand.

Stealth dicing

A single pass laser dicing disco is an ideal method for stealth DICing, because the laser based cutting method does not involve external tensile stress or chemical agent. Different parameters of laser processes include repetition rate, pulse overlap, and energy. Depending on the cutting process, the cut-edge quality and flatness of the final cuts may vary. These characteristics are the key to stealth dicing success.

Among its advantages, this technique eliminates problems caused by conventional dicing methods, such as blade ablation and debris. Stealth dicing also reduces the amount of wafer waste, and its narrow dicing path means more chips per process. This results in a higher production yield. Another benefit of stealth dicing is that the cutting process is gentler on the environment, reducing water consumption by up to 622 tons annually.

Another key feature of this laser dicing disco is its low pulse energy. Its low-energy pulses produce very little heat, which is beneficial for stealth dicing.

The size of the modification zone is directly proportional to the cracking incidence of the die. Stealth dicing, in contrast, does not require water for processing and cleaning, and does not damage the die surface. In addition, the process also narrows the street width, making it useful for long-shaped dies. It also increases yield by allowing for a 15mm saw lane.

This stealth dicing process is used to separate a wafer into individual ICs. The laser induced stress does not overlap with the first pulse, but accumulates over the second pulse. As the repeat rate increases, the stresses will accumulate, causing cracks to propagate along the laser path. The cracks will spread across the entire thickness of the quartz plate, and the single step stealth dicing process will result from the joining of the cracks.

Laser full cut dicing

The DGP8761 is the successor of the DGP8760, a high-performance dicing disco with integrated backside and stress relief processing. The machine’s newly developed spindle contributes to high-speed grinding, resulting in reduced processing time and a shorter cycle time. The machine’s optimized handling layout also shortens cycle time.

DISCO has established a new application for laser full cut dicing, which is expected to increase processing speed and UPH. The system can process backside metal film attached Silicon wafers. It can also dice GaP, InP, and GaN wafers. A special chuck table can be incorporated into the system, enabling it to process wafers in very thin finishes. Further, the system also supports DAF, which requires a wafer mounter and a dedicated laser head.

Stealth dicing is another option for low-k devices. Unlike traditional dicing processes, stealth dicing has no waste and is completely safe. This method can reduce the kerf width without chipping the material. Additionally, it can produce sharp edges. The benefits of stealth dicing are numerous. Its low external impact makes it an excellent option for chip-free MEMS manufacturing.

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